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Keyword [Electronic packaging]
Result: 21 - 40 | Page: 2 of 10
21. Development Of Middling Temperature Curing Isotropic Conductive Adhesive For Electronic Packaging Interconnection
22. FEM Simulation Research On Thermal Reliability Of BGA Solder Joints Under Material Choice
23. The Research On Properties Of SiC_p/Al Composite For Electronic Packaging
24. Study On Microstructure And Properties Of SiCp/Cu Composites
25. Time-Dependent Damage Coupled Constitutive Model Of Solder Alloy In Micro-Electronic Packaging At High Tempertaure And It's Application
26. The Preparation And Property Research Of Epoxy Resin Based Electric Electronic Packaging Material
27. Preparation Of Advanced Electronic Packaging Complex Material-Cu/ZrW2O8
28. Fabrication And Properties Of SiCp/Al Electronic Packaging Housing By Gas Pressure Infiltration
29. The Preliminary Study Of A New Lead-free Interconnection Method Based On Electromagnetic Stirring
30. Study On The Preparation And Properties Of Electronic Packaging Material ZrW2O8/E-51 With Lower Linear Expansion Coefficient
31. Study On Preparation And Properties Of Cu/ZrW2O8 Composites
32. Fabrication And Properties Of β-SiCp/Al Electronic Packaging Material By Pressureless Infiltration
33. A Study Of Tungsten-Copper Composites Materials With Low CTE And High TC Used For Electronic Packaging
34. Numerical Analyse Of The Dynamic Stresses Distribution In Adhesively Bonded Metal Joints
35. The Study Of Fabrication And Properties Of SiCp/Al Electronic Packaging Materials
36. Study On Centrifugal Casting Process Of The SiC Particle Reinforced Aluminum Matrix Composites For Electronic Packaging
37. Formation And Characteristion Of Multicomponent Boron Carbide Cermets
38. Study On B4C Ceramic Composites And Their Fine Machining Processes
39. Preparation And Properties Study Of 3, 3', 5, 5'-Tetramethyl-diphenol And O-cresol Formaldehyde Epoxy Resin Blends
40. The Curing Study Of O-Cresol Formaldehyde Epoxy Resin(o-CFER) And Its Nanocomposite
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