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Keyword [Electronic packaging materials]
Result: 1 - 20 | Page: 1 of 2
1. Pressureless Infiltration Of SiCp/Al Electronic Packaging Materials With Particles Of Bimodal Size Distribution
2. Study On The Preparation And Properties Of Electronic Packaging Material ZrW2O8/E-51 With Lower Linear Expansion Coefficient
3. The Study Of Fabrication And Properties Of SiCp/Al Electronic Packaging Materials
4. Formation And Characteristion Of Multicomponent Boron Carbide Cermets
5. Study On B4C Ceramic Composites And Their Fine Machining Processes
6. Powder Metallurgy Fabrication And Properties Of Sip/Al Functional Gradient Materials
7. Rolling The Composite Of Cu / Mo / Cu Electronic Packaging Materials
8. Prepared By Powder Metallurgy To The Study Of The Si-al Electronic Packaging Materials
9. Molding Process Of Beo Ceramic Electronic Packaging Materials And Sintering Aids
10. Preparation And Properties Of Liquid Crystal Epoxy Based Thermal Electronic Packaging Materials
11. The Research On Interface Design And Thermal Properties Of Carbon/metal Composite Materials Used In Electronic Packaging
12. Study On Fabrication And Properties Of Diamond/Al Matrix Composites Used In Electronic Packaging
13. Study On Ramie Reinforced Thermoplastic Resin Base Electronic Packaging Materials
14. The Research On Microstructure And Properties Of Electronic Packaging SiC_p/Al Composite Fabricated By Powder Thixoforming
15. Research On Microstructure And Thermal Physical Properties Of TiB2/Si-Al Composites For Electronic Packing
16. Design And Preparation Of Electronic Packaging Materials With Water Vapor Resistance
17. Preparation And Properties Of β-SiCp/Al Composite Used For Electronic Packaging
18. Design,Fabrication,and Performance Research Of Polymer-based Thermal Conductive Material With Oriented Structure
19. Fabrication And Property Study Of Diamond/Al Composites Used For Electronic Packaging
20. Basic Research On Preparation Process Of Cu/Invar Layered Composites
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