Mechanical planarization - Globe Thesis

Keyword [Mechanical planarization] Result: 21 - 40 \| Page: 2 of 3
21.	Evaluation and modeling of alternative copper and inter-layer dielectric chemical mechanical planarization technologies
22.	Investigation of the chemical and electrochemical phenomena in the chemical mechanical planarization of copper
23.	Tribological, kinetic and thermal characteristics of copper chemical mechanical planarization
24.	Physicochemical Modeling of Copper Chemical Mechanical Planarization (CMP) Considering Synergies in Removal Materials
25.	Tribological, thermal and kinetic characterization of dielectric and metal chemical mechanical planarization processes
26.	Effects of Slurry Chemistry on the Rate of Agglomeration of Alumina Nanoparticles for Chemical Mechanical Planarization
27.	Dissolution, corrosion and environmental issues in chemical mechanical planarization of copper
28.	Role of slurry chemicals in chemical mechanical planarization of copper
29.	Processing, reliability and integration issues in chemical mechanical planarization
30.	Role of slurry chemicals in chemical-mechanical planarization of copper interconnects
31.	Stochastic models for material removal rate (MRR) in chemical mechanical planarization (CMP) process
32.	Colloidal aspects of chemical mechanical planarization (CMP)
33.	Investigation of novel alumina nanoabrasive and the interactions with basic chemical components in copper chemical mechanical planarization (CMP) slurries
34.	Optimization of polishing kinematics and consumables during chemical mechanical planarization processes
35.	Fundamental characterization of tribological, thermal, fluid dynamic and wear attributes of consumables in chemical mechanical planarization
36.	Mechanism of amino acid interaction with silicon nitride surface during chemical mechanical planarization
37.	Development of a new generation polyurethane polishing pad used in chemical mechanical planarization of microelectronic materials
38.	A general framework for models of chemical mechanical planarization of silicon dioxide
39.	The role of complexing agents in the chemical-mechanical planarization of copper
40.	Chemical effects during silicon dioxide chemical mechanical planarization
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