Microelectronic - Globe Thesis

Keyword [Microelectronic] Result: 1 - 20 \| Page: 1 of 4
1.	Investigation Of Characteristics For Adhesive And Bonding Reliability For COG Assembly Under Hygrothermal Conditions
2.	Study On Damage Constitutive Model And Failure Mechanism Of Lead-Free Solder In Microelectronic Packaging
3.	Study On The Microelectronic Solder Balls Preparation Method
4.	Research Of Lead-free Solders In Microelectronic Joining
5.	Reliability Analyse Of Flip Chip Solder Joint
6.	Study On The Metallurgical Behavior Of Bond Interface In Ultrasonic Wedge Bonding
7.	A Study Of Bonding Reliability For Silver-epoxy Adhesive
8.	Study On Electroless Ni-P Film Plating In Microelectronic Packaging
9.	A Numerical Simulation Study On Wetting And Bridging Of SnAgCu Solder Liquid
10.	A Numerical Simulation Study On Wetting And Bridging Of Snagcu Solder Liquid
11.	The Microelectronic Assembly Of High-performance Silver Conductive Adhesive
12.	Preparation And Characterization Of Atomic Layer Deposition-derived High-Îº Thin Films For Microelectronic Applications
13.	The Preparation Of Ultra-fine Copper Powder And Its Application In Microelectronic Industry
14.	Calculation Of Elastic Fields Under The Influence Of Joule Heating And The Temperature Field In Microelectronic Solder Joints
15.	Study On Interfacial Reactions In Ni/Sn-xZn/Ni And Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration
16.	Research On Cu Based Nanosolders For Low Temperature Cu-cu Bonding
17.	Controllable Preparation, Field Electron Emission And Photoelectric Detection Of Selenide And Selenide/graphene Nanocomposites
18.	Chemical Synthesis And Application Explorations Of Iron-Based Magnetic Nanomaterials In Microelectronic Packaging
19.	Manipulation Of Structure And Electronic Properties For Novel 2D Materials
20.	Research On Tin Whisker Growth And Mitigation For Electroplated Pure Tin Films
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