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Keyword [PBGA]
Result: 1 - 3 | Page: 1 of 1
1.
Effect of aging on the transformation of phases in solder joint of PBGA packaging
2.
Reliability study of tin-lead and tin-silver solder joints in PBGA packages
3.
Stress And Strain Analysis And Optimization Of Large Size PBGA Solder Joint With Underfill Under Combined Loading
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