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Keyword [electronic package]
Result: 1 - 12 | Page: 1 of 1
1.
The Study Of Heat-curing Copper Conductive Adhesives
2.
Study On High Performance Poly (Phenylene Sulfide) Materials For Electronic Encapsulation
3.
Experimental Research On Solder's High Temperature Mechanical Property And Thermal Cycle Numeric Simulation Of Solder Joints In Electronic Package
4.
Preparation Of High Volume Fraction SiC/Al Package Materials By Gel-casting Method
5.
Fabrication And Reserch Of Aluminum Matrix Composites Used In Electronic Package
6.
The Evolution Behavior Of Interfacial Bubbles And Its Effect On Soldering Interfacial Reaction
7.
High Performance Epoxy Resin Using In Electronic Package Material: Synthesis And Properties Studies
8.
The Laser Sintering Prepared Electronic Package With Tungsten-copper Composite Material
9.
Simulation Research On Electronic Package Board Level Solder Joint Under Multiphysics Load
10.
Research On Reliability Of Microelectronic Packaging Solder Joints Under Electric Load
11.
Mechanical properties and microstructure investigation of Sn-Ag-Cu lead free solder for electronic package applications
12.
Preparation And Properties Of Low Dielectric Polyimide Nanocomposites
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