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Keyword [solid-state aging]
Result: 1 - 4 | Page: 1 of 1
1.
Study On Interface Structure And Mechanical Property Of Cu/Ni(P) Bi-layer Solder Joint
2.
Study On Interfacial Reaction And Mechanical Properties Of Ni-W-P/Cu Double-plated Solder Joints
3.
The Reliability Of Ф5μm Cu/Sn High Density Microbump
4.
Electromigration and solid state aging of flip chip solder joints and analysis of tin whisker on lead-frame
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