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Keyword [underfill]
Result: 1 - 10 | Page: 1 of 1
1.
Flip-chip Reliability Under The Conditions Of Temperature Shock
2.
The Study On Preparing Single-component Flow-type EP Underfill Adhesives
3.
Study On The Rheological Properties Of Epoxy Resin Matrix Composites And Underfill Technology
4.
The Effects of Isothermal Aging on the Mechanical Behavior of Underfill Encapsulants
5.
A study on inconsistent epoxy dispense in the application of capillary underfill processes
6.
Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill
7.
Cure behavior of epoxy polymers used in microelectronics
8.
Investigation into the solderability issues in surface mount manufacturing with the use of thermal adhesive underfill
9.
A study of polymeric materials for microelectronic applications: Low-k dielectric thin films and flip chip underfill encapsulants
10.
Performance Of Underfill Materials Used For 3D Chip Packaging And Their Adhesion And Failure Behavior
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