Investigation On The Preparation And Properties Of SiCp/Cu Matrix Composites

SiC particles reinforced copper matrix composites (SiCp/Cu composites) can have many favor properties, such as good wear-resistance and superior electrical/thermal conductivity, which makes them one of the main research topics in the field of metal matrix composites in recent years. For this paper, the (nano-scale, sub micro-scale, micro-scale) SiCp/Cu matrix composites were systematically investigated. The detail research contents and some innovative conclusions are listed as follows:The effective-cost clearing technology of SiCp was developed, and the SiCp/Cu composites were fabricated through powder metallurgy plus hot extrusion method. It was found that the (nano-scale, sub micro-scale, micro-scale) SiCp/Cu composites exhibited uniform and compact microstructure, together with superior physical and mechanical properties.The wear behaviors of SiCp/Cu composites were investigated. It was found that the incorporation of the SiCp particulates of various grit sizes all contributed to increase the wear-resistance of the SiCp/Cu composites considerably. The SiCp/Cu composite reinforced with the SiCp particulates of larger grit size showed better wear-resistance than that reinforced with the SiCp of a larger grit sizes. However, the SiCp/Cu composite reinforced with larger SiCp particulates of larger lead to more severe scuffing to the counterpart steel surface. In terms of the comprehensive wear-resistance of the frictional pair, SiCp/Cu composite reinforced with sub micro-scale SiCp presented best tribological properties. In addition, it was found that a small amount of adding of graphite can effectively decrease adherence, leading to good adherence antifriction properties, with litter damage to mechanical and physical properties.The effect of laser shock processing (LSP) on the SiCp/Cu matrix composites was investigated. The experiment results indicated that LSP improved tensile strength. The finite element analyses based on ANSYS/LS-DYNA software indicate that the LSP induced residual compressive stress, leading to strengthening of the composites meanwhile with litter damage to the boundary between SiCp and copper matrix.Vacuum brazing of SiCp/Cu composite was carried out using Ti and AgCuTi as brazing filler metal. The results showed that Ti filler is better than AgCuTi filler for this composite, with the increase of the volume fraction of SiCp, the shear strength of the joint decreased continuously and rapid decrease as SiCp content above 10vol.%.The electro-spark overlaying of the SiCp/Cu composite was investigated. Experiments and finite element analysis show that LSP can bring in residual compressive into the electro-spark overlaying, leading to increase of tensile strength and hardness, even for the composite overlaying with cracks.The cutting property of the SiCp/Cu composite was investigated. The results show that, because of the hindering of SiCp to dislocation, the SiCp/Cu composite presented typical brittle separation in cutting process. The cutting force increased with the cut depth and feed quantity, and decreased with cutting speed increasing. These are different considerably from those of QSn6-6-3, H59-1 and pure CuThese above researches not only may provide theoretical basis and technology route for preparing high-quantity SiCp/Cu composite, but also can provide basic date for engineering application of SiCp/Cu composite.