| BT resin occupies the most market share of hig(?) performance resins for PCB. However, most of such PCBs have to be imported from abroad, China only takes 5%-10% of such PCBs. In our research, modified BT resins were prepared with BADCy, BMI and DBA, the problems of strong crystallinity of BADCy, BMI and the solubility of high melting-point BMI in acetone were solved. The cure mechanism of BT, modified BT system and the cure schedule of modified BT were studied by DSC, FTIR. Kinds of cured resins and E-glass cloth reinforced composites of modified BT system were prepared, the thermal expansion behavior, mechanical properties, dielectric properties and moisture property were tested and compared with other systems which had already applied in aerospace industy and electronic industry. The results showed that:BADCy and BMI could copolymerized besides self-polymerization in BADCy/BMI system. While in modified BT resin, DBA changed the cure path of BMI, but it only had catalytic action for BADCy, and the cuerd modified BT was IPN system. DBA was an excellent modifier for BT resin, modified BT system could be dissolved in acetone easily, and had a good performance of stability. The cure kinetic parameters(△E=45.9kJ/mol, n=0.842) and schedule(170℃/2h+200℃/2h+240℃/2h) were established. The modified BT resin and E-glass cloth reiforced composites had excellent comprehensive function, which satisfied the requirement of high performance matrix resins and composites, and the composites were apt to be used in the field of radome, high speed IC package and PCB. |