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Research On Preparation And Property Of Glass Binder For Thick-film Metallization

Posted on:2011-07-08Degree:MasterType:Thesis
Country:ChinaCandidate:R Z ShuaiFull Text:PDF
GTID:2121330338981349Subject:Materials science
Abstract/Summary:PDF Full Text Request
In this paper, the primary aim was to prepare glasses that had different thermal expansion coefficient by high temperature molten method in order to match conductor and substrate. Wet milling, high temperature molten, screen printing and sintering were used for sample preparation. The structure of sample was characterized by means of XRD and SEM.Frist, effect of sintering temperature and additive on the dielectric property, sintering property, porosity and water absorption was discussed. Alkaline-earth oxide and ZnO could reduce glass transition temperature and accelerate sintering, and the influence of them was analyzed. It was found that Al2O3 inhibited phase separation and suppressed crystallization of glasses because it played the role of a network former, and it also could adjust thermal expansion coefficient of the glass. Next, wetting characteristics between glass and substrate had been discussed. It is necessary to research the wetting behavior of glasses in order to achieve a good film adhesion. It was found that glasses with ZnO could wet the substrate, but crystallization was serious. The wettability of glasses with BaO was excellent, and a bit particle penetrated into grain boundary of the substrate, which increased the adhesion strength.Last, thermal property of glasses was explored. The structure of glass determined thermal expansion coefficient. Interaction between cation and non-bridging oxygen influenced thermal expansion coefficient. Network-modifying ions (Ba2+, Ca2+, Mg2+) made network structure loosen and increased thermal expansion coefficient. Zn2+ entered into network and damaged the network, so it also increased thermal expansion coefficient. In thermal shock, the stability between printed layer and substrate was better when their thermal expansion coefficient matched to each other.
Keywords/Search Tags:dielectric property, wettability, thermal expansion coefficient, thermal shock
PDF Full Text Request
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