Simulation On The Cure Process Of Resin In Composites

The cure reaction behaviors and the curing mechanism of the resin system have theoretically instruction to the produce of the material. In this paper, Non-isothermal differential scanning method was used to study epoxy resin mixture cure reaction. The cure reaction behaviors and the curing kinetics of the diglycidyl ether of bisphenol A (DGEBA) with m-phenylenediamine(m-PDA) at different heating rates, in order to determine the parameters of the curing kinetics equation and the optimized initiators system and curing conditions.Non-isothermal differential scanning calorimetry (DSC) technique was used to study the curing kinetics of diglycidyl ether of the resin system at different heating rates. The float of activation energy demonstrated that curing reaction is multi-step reactions during the initial stage and final stage of reaction process. Kinetic parameters were analyzed with single-step reaction model (Malek method) and multi-step reactions method (variable kinetic parameters method). Autocatalytic reaction equation was use to describe resin curing behavior and calculated curves with variable kinetic parameters method show good agreement compared with experimental data. Kinetic parameters (activation energy and pre-exponent factor) may be taken as a function of the degree of conversion interval and be considered constant value to describe entire curing process at a given fixing interval. Different mechanism function can be used to describe epoxy resin curing behavior as long as certain interval is short enough.By the coupling of the equation of curing kinetics and the equation of diathermanous, we get the modeling of the temperature field and the degree of curing of the DGEBA/ m-PDA. By giving it the same initialization of curing with the real experiment, we compared the result with the real data, and proved its reliability.