| Silicon carbide get a abroad apply in the oil,petrochemical,aviation,spaceflight and automobile industry field because of excellences of high rigidity and strength,low density,well heat transmission and low swelling modulus. But it have difficulty in getting high precision and well surface quality in precision and ultra-precision machining because of the big brittleness, and also have the problem of low manufacturing efficiency and high product cost. With the development of the diamond ultra- precision machining, this technology make the silicon carbide and other engineer structural ceramic and brittle material get a prodigious applying foreground.This article firstly carry through a systemic investigation of the silicon carbide ceramic application, with a holistic analysis from the material preparation,basic capability,application and the precision machining techno- logy, and then have a investigation in the crystal structure and the microstructure disfigurement of silicon carbide ceramic, also have a academic investigation in the wiping off mechanism of the grinding machining of silicon carbide, and at last carry experimentations of single point diamond scratching and diamond precision grinding.Through the academic analysis and experimental investigation , we get a embedded understanding of the wiping off mechanism and the scratched surface forming mechanism in the silicon carbide single point scratching experiment, and have studied the surface figure and the grinding force characteristics in the precision grinding of silicon carbide, and have profoundly analyzed the machining capability , mechanism and technical problem of silicon carbide , and also have validated the feasibility of using rough diamond grinding wheel by precision dressed in the silicon carbide precision grinding, and we have got a well academic and experimental foundation in the next step of the silicon carbide and other brittle material precision and ultra- precision machining.
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