Fabrication And Properties Of SiCp/Al Electronic Packaging Housing By Gas Pressure Infiltration

Silicon carbide particle reinforced aluminum composite have outstanding physical and mechanical properties, and could be used as favorable structural components. Due to its excellent abrasive properties, SiCp/Al have attracted considerable application in automobile and combustion engine' s wearing pieces. Net shape can be successful achieved through gas pressure infiltration, which eliminate composite' s related treatment. In this article, SiCp/AI electric packaging housing were fabricated by gas pressure infiltration, and its physical and mechanical properties were studied.SiC preform housing was successful fabricated by selecting bimodal SiC particle, powder treating, preparation of wax slurry, pouring SiC housing body, wax extraction and sintering. The difference of mechanics among gas pressure infiltration, pressureless infiltration, centrifugal infiltration, squeezing infiltration has been studied. And the reason of outflanking in gas infiltration was analysed.Comparing SiCp/Al composite with aluminum matrix, SiC particle existence could significant reduce composite ' s linear CTE and physical CTE. The composite's CTE curve can be separated into three different parts by slope. The linear CTE of composite decrease with increasing particle volume fraction in the same temperature. The restraining effect of single size SiC particle on matrix is smaller than that of bimodal size particle. SiCp/Al' s inflexion spots of physical CTE also decrease with increasing SiC particle' s volume fraction. In the temperature range of 30℃ ～200℃ , linear CTE will decrease with increasing composite ' s density . It is generally known that considerable amount of thermal stresses would generate upon cooling from the processing temperature due to the large difference in CTEs of the metal matrix and ceramic reinforcement, and some part of them reserve as the residual stress in the composite as cooled to room...