Research On Design Method And Properties Of Eletronic Packaging Single Crystal Copper Wire

Copper-based interconnect is an emerging trend in microelectronics packaging. Some studies have shown that copper wires may serve as a viable, cost-effective alternative to gold in some high-end, ball and wedge bonding applications.This thesis is investigated the key problems, such as ingot, equipment, mould, lubricate, annealing and environment in drawing, and to build the specific solved programs. Against the common continuous solidification equipment do not meet the criteria of high performance single crystal copper bonding wire, the vacuum melting and argon protecting continuous undirectional solidification equipment were designed and the ingot of high performance single crystal copper bonding wire were prepared. Against the easing oxidized properties of single crystal copper bonding wire when heat treatment, the protect equipment was designed, and avoiding oxidized in heat treatment. And get the technics on drawing of single crystal copper wire. Through testing the single crystal copper bonding wire mechanical property and electronic property, the changed rule of single crystal copper bonding wire break load and elongation in different temperature and times were investigated. And the bonding properties were investigated and tested.From the study, it is found that the break load and electrical resistivity became low and elongation became large when the temperature and times increased. For 0.025mm single crystal copper bonding wire, the break load and elongation were excellent at heat treatment in 410℃ and 2.4s. The single crystal copper bonding wire diameter and heat treatment temperature/times coincidence the function of Y=397.93+24.55X-4.22X~2 and Z=-2.41+5.76X-1.08X~2,in function X, diameter (Mil), Y, temperature (℃), Z, times(t).The single crystal copper bonding wires can be bonded on the aluminum pad by thermo-sonic ball bonding and formatted excellent bonding and mechanical properties. The pads were not found damage after corroding. The single crystal copper bonding wire can meet the industrial demand of mechanical properties. And the stabilities of large diameter single crystal copper bonding wire were excellent, the number of CPK is 3.25 and greater than the criterion 2.0, and have the excellent application value.