Preparation Of SiC_p/Cu Nanostructure Composite By Ball Milling And Hot Pressed Sintering

In this work, the existing research condition of copper base composite, and the mechanics, technology, influencing factor of ball milling-hot pressed sintering were summarized, and then it introduces the methods and progresses of experiment. We obtain the better technological parameter of synthesizing nanostructure SiCp/Cu composites by studying the technological conditions which contain the ball material, the mixture ratio of rough material, the rate of the ball grinder, the balling time, the volume fraction of nano-particulate SiC, and the hot pressing temperature. The final milling parameters were optimized according to the experiment results.The SEM pictures of microcosmic structure indicate that nanostructure SiC particles dispersed well on the copper matrix by ball milling, nano-particulates SiC are embedded in Cu grains gradually and distributed uniformly as the milling time increase. This method resolved the conglobation problem of nano-particulates SiC, which offers the premise for the following sintering experiments. Because the power activity has increased after ball milling, the sintering temperature falls. But the composite also has a lower density because of the existence of the nanostructure particle. And the further research indicated that the technological parameter has an obvious influence on the density, hardness, conductibility and frictional behaviour of the nanostructure composite.