2D Waveletanalysis On KDP Crystal Surface Micro-Topography By SPDT

On the high-energymulti-path Inertial Confinement Fusion solid laser driver,laser weapon and other advanced equipment, only the large-size non-linearelectrical-optical crystal KDP with high accuracy can be used to make opticalfrequency multiplication transition and Pockel's switch parts. Ultra-preciseSingle point diamond turning is the main machining methods to obtain the high-quality KDP crystal surface. The basic request of ICF laser driver to the KDPcrystal surface roughness is Rms≤5nm.Because the single point diamond cuttingis a special way, the vibration between the tool and KDP crystal reflect on themachined KDP crystal surface, so that KDP crystal micro-topography whichmachined by the single point diamond cutting has provided extremely valuableinformation on the surface.Firstly, analyzed the influencing factor of KDP crystal micro-topographywhich machined by the single point diamond cutting. Combining on the basictheory of wavelet, established a theoretical model to analyze the machinedsurface with 2D wavelet multi-scale analysis.Secondly, used AFM to measuring the 3D micro-topography of KDP crystalsurface which machined by the single point diamond cutting. Then based on thetwo-dimensional wavelet multi-scale analysis model, analyzed the KDP crystalmicro-topography, separated differentfrequency 3D surface.Finally, did the KDP crystal cutting experiment on ultra-precision machinetools. Measured the cutting force and vibration signal in the cutting process.Using the AFM and CCI, detected the KDP crystal machined surface. Theexperiment data is processed. To find the relationship between the processingparameter and the 3D micro-topography of different layer with spectrum analysis,verified the contacting between processing factors and surface micro-morphology.