| In order to reduce natural thermo-solutal buoyant flow and overcome the heavier solute deposition at liquid-solid interface that cause the non-flat interface in vertical directional solidification , Al-4% Cu and Al-11 % Si alloy was solidified at horizontal directional solidification device by changing the external magnetic field strength, speed traction methods to study the thermal electromagnetic dynamics effects on microstructure. It was founded that with increasing magnetic field strength B, the primary arm spacing increase with an oscillation phenomenon: a boom of the primary arm spacing with the B on the whole growing process and a change in the local fluctuations, because of the interaction between the TEMHD and MHD . |
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