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Research On Layered Micro-electroforming And Design Of The Device

Posted on:2009-07-16Degree:MasterType:Thesis
Country:ChinaCandidate:J Q MaoFull Text:PDF
GTID:2121360272977244Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
technologies of the 21st century.With the development of MEMS,the demands to micro-structures are more and more high.The high-aspect-ratio 3D-microstructure is one of key technologies among them.One of the major challenges in MEMS is the development of 3D fabrication methods. EFAB technology is an additive micromachining process based on the selective electrodeposition of multiple patterned layers of materials such as nickel or copper. It will make micro-technology accessible to mainstream applications in industries.But there are some problems of EFAB,such as,the singleness of materials, some defaults emerging in deposition layers,low efficiency and so on.A new EFAB technology was proposed,it not only can solve some problems of traditional EFAB technology but also can electroform alloy,and the elemental research on the new technology was carried out.The theoretical analysis and experimental verification are also given in this thesis.Also,the theoretical model of this technique is performed in detail.A new micro EFAB set-up is developed independently by the author.Double vertical column II style-C style hybrid structure is chosen as the main mechanical structure,which has the advantage of excellent structure rigidity,compact framework dimension as well as good maneuver ability and maintains ability.The author independently develops a control system based on the PCI-series bus motion controller.The control software is programmed by Lab VIEW graphic language.The whole control system fulfils the requirements of control in micro EFAB set-up.The research on how micro EFAB process influences the machining accuracy and product quality is important.This experimental results indicate that the new electroforming technique is viable.
Keywords/Search Tags:Micro-technology, MEMS, high-aspect-ratio, EFAB, PCI-series, Lab VIEW
PDF Full Text Request
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