Research On Copper Hot-dipped Aluminum And Cu/Al Interface

Cu/Al compound material not only have the advantage of Cu such s good conducting electricity,high transmitting heat rate,low electric resistance and beautiful appearance,but also have the advantage of A1 such as light weight and economy etc.the abstract.Therefore,it can be widely used with every realm,such as electric appliance,electric power,metallurgy equipments,machine,automobile,tools and so on.However,there are the problems of technology hardly controlled,too thick interface,low interface quality and so on in the manufacturing methods existed Aimed at these problems,and this work is in order to get ideal interface bonding with introducing the technology of copper hot dip aluminum.The research contents included:copper pretreatment technique,options for plating auxiliary,reactions of plating auxiliary,study on plating thickness kinetics,bending test, conductivity and so on.The results show that the optimum parameters for copper plated is 2% KF aqueous solution at 30-40℃.It can be concluded the reactions between plating auxiliary with molten Al according to the analysis of the elements contents.Besides,the XRD result of the film plated by KF aqueous solution statements that the phases included Cu,Al,CuAl₂ in the interface coating.Consequently,in can be deduced that the final product for all the plating auxiliary reactions is AlF₂,which should be vaporized in gas phase.The analysis on the Cu diffusion in molten Al shows that the diffusion rate with the plating auxiliary effect is much lower than that without it at the same temperature.The calculated conductivity isρ=1.758×10^-2～1.767×10^-2O*mm²/m,which is completely in conformity with the Cu/Al wire standards.When the hot dipping time is constant,the thickness will vary from the hot dipping temperature.And when the hot dipping temperature is constant,the thickness varies with the increasing time.Study on the bending behavior indicate that plating auxiliary improve the interface remarkable.And the interface bonding is good.Cu hot dip Al can provide with the significant results for further developing Cu/Al compounds.There is instructive guidance for the future new manufacturing methods for compounds.