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A Study Of The Formation Of Cu-Ti-O Thin Film On The Al2O3 Surface By Sol-Gel Method

Posted on:2010-07-13Degree:MasterType:Thesis
Country:ChinaCandidate:Z Z FanFull Text:PDF
GTID:2121360278455168Subject:Materials Processing Engineering
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The high volume fraction of ceramic composite materials(Al2O3/Cu) that is good thermal conductivity of copper and wear resistance of alumina ceramic,and its applications have obvious value and market prospects.Therefore receives the domestic and foreign widespread attention.The use of preparation of pressureless infiltration of this material has very good advantages.As a result of poor wetting between copper and alumina ceramic,it is difficulty for preparing high volume fraction Al2O3/Cu composites by pressureless infiltration. The purpose of this paper is trying to improve the wetting between copper and alumina ceramic by the thin film.In this paper,the Sol-gel method was used to prepare the complex coating of Cu-Ti-O on the alumina ceramic surface with TiCl4,(CuCl2·2H2O,Cu(NO3)2·3H2O,Cu(CH3OO)2·H2O) and ethanol,coating times and preparation of coating solution on the coating structure and performance was discussed.Metal copper and alumina cermic with above coatings place in a vacuum environment for the conduct of wetting experiments.Thin pilm with composition of phase and wet temperature on the interfacial wettability were studied.Using different methods did the microscopic analysis with the wetting interface of Al2O3/Cu.From the results,conclusions can be obtained:Cu-Ti-O thin film are mainly composed of anatase TiO2,CuO and Cu2Ti4O;The solution,which is disposed with of Ti concentration in 1.0 mol/L,copper and Ti ration of 1:4,preparing thin film on the alumina ceramic. Combination strength is better between the thin film and substrate.The thin film have Cu2Ti4O.In the wetting experiment,in addition to CuO,other two components can improve the wettability between copper and alumina ceramic.Compared with TiO2,Cu2Ti4O could effectively promote copper melt wetting of alumina ceramic,cotact angle can reach 77°.At the same time,as the increase of temperature,the contact angle decreases continuously.
Keywords/Search Tags:Sol-gel method, Al2O3/Cu, Cu-Ti-O thin film, Cu, sessile-drop method, wettability
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