Metallurgy Bonding Of Closed-cell Aluminum Foam With Aluminum And Aluminum Alloy Plate

Metallurgy bonding between aluminum melt and the plate (pure aluminum and aluminum alloy) were studied, the effect of compound temperature and time on the diffusion layer thickness between the aluminum melt and the plate were confirmed. Then using direct metallurgy bonding technology, the high temperature aluminum foam and the plate were compounded with each other, the effect of aluminum and aluminum alloy plate thickness, bonding temperature and time on the diffusion layer thickness between the plates and aluminum foam were studied. The interface microstructures between aluminum melt and the plate were observed, and the diffusion layer thickness and micro-hardness were measured.Experiment results show that the diffusion layer thickness between aluminum melt and pure aluminum and aluminum alloy plates is increased with increasing bonding temperature and time. At preheating temperature range of 400 and 450℃and bonding speed between 53.9 and 74.4 mm/min, the aluminum foam core and pure aluminum plate are well combined metallurgically with the diffusion layer thickness between 39 and 44μm, the changes of compound speed between aluminum foam and pure aluminum plate have little effect on the diffusion layer thickness. The temperatures in pure aluminum plate decrease as the distance increases from compound surface to free surface, when the pre-heating temperature of the plate is higher, the temperature of free surface is higher too and the temperature in the plate falls more slowly. When the aluminum alloy plate is preheated at 240℃with a speed of 58.3 mm/min, a minimum thickness of 7.9 mm is needed for the aluminum alloy plate. Under the same technologies, using pure aluminum plate can get bigger diffusion layer thickness than aluminum alloy plate, good metallurgy bonding and outside surface quality.