| Visible light-curing materials have extensive application prospects in electrical apparatus, electronic, medicine, automobile and architecture as adhesive and filling material due to itsefficiency, environmental friendship and economy. However, bond force between visible light-curing resin and substrate is mainly of physical-mechanical force, while curing depth and Degree of Curing are not well because of the bad light utilization efficiency with adding inorganic filler. Therefore, how to improve the properties of adhesive and filling material has become the research hotspot.Trimellitic Anhydride Chloride (TMC) and 4-methacryloyloxyethy trimellitate anhydride (4-META) which were characterized via FTIR and1H NMR were synthesized by acyl chloride method. Visible light-curing vinyl ester epoxy resin and composites were prepared by melt blend.Curing rate, bond property, degree of curing and thermal properties of resin was studied, and mechanical performance, thermal properties, degree of cure, linear polymerization shrinkage and water resistance of composites were analyzed.1. TMC and 4-META were successfully synthesized, the chemical structure of which were indicated via FTIR and1H NMR. The chlorine content of TMC was 16.84%, and its purity reached 97.92%. DSC analysis indicated that the melting point of the two compounds were 68℃and 94℃respectively. The TMC yield was 80.8% by the law of conservation of mass, whilst the 4-META yield was 63.7%.2. Visible Light-curing epoxy vinyl ester resin was prepared by melt blend. The uring rate reached maximum value when CQ and DMA content were 0.25wt%and 0.20wt%respectively, while curing time was about 20s. The bond property of the resin with adding 4-META significantly improved, and the tensile-shear strength increased from 1.19MPa to 2.57MPa. According to the standard baseline method, the degree of curing was 70%when irradiation time was 60s. The thermogravimetry (TG) analysis showed that the onset temperatures for 10%and 50%weight loss of resin were about 372℃and 427℃respectively, whilst Tg was 77.4℃. 3. Visible Light-curing epoxy vinyl ester resin/SiO2 composites were also prepared by melt blend. The minimum linear polymerization shrinkage was 0.88%, while water absorption and water dissolvability were 25.7μg-mm-3 and 44.38μg·mm-3 respectively. Curing depth rose with irradiation time, while diminished with filling content. The maximum curing depth was 9.6mm. Compared with the original SiO2, the surface modified SiO2 was well compatible with the resin matrix, which significantly increased compression strength of composites. The maximum compression strength was 268MPa. The degree of curing was 66.2%when irradiation time was 60s. The composites had well thermodynamic performances.The onset temperatures of composites for 10%and 50%weight loss of composites were also about 372℃and 427℃respectively, whilst its Tg was 82.9℃and its modulus was 10 times of pure resin's.
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