| (Ti,Al)N films were deposited by a FCVA technique under a nitrogen atmosphere. The (Ti,Al)N films with different microstructure and properties were synthesized at different temperature.and different bias voltageThe films thickness was tested by AMBIOS Xp-2 profile meter. X-ray diffraction was used to characterize the structure of the films .The micro-hardness was also studied.The crystal structure and mechanical properties of (Ti,Al)N films are strongly dependent on the nitrogen partial pressure The structure of (Ti,Al)N films is composed of Ti2AlN phase,Ti2N phase,TiN phase and TixAly phase.Adequate of N2 is essential to deposit (Ti,Al)N crystal.The hardness increases to a maximum at the pressure of 1.1×10-1pa ,then decreases with increasing nitrogen partial pressure. The microhardness and wear-resistance of (Ti,Al)N with FCC microstructure were both improved, in addition, films deposited in heated environment had lower coefficient of friction compared to these synthesized at RT because of improved microstructure texture and intensity. The microstructure and performance differed from bias voltage change at different temperature above two due to the affinity of atoms, which determine crystal orientation and film properties.The TiAl sublayer between SS substrate and (Ti,Al)N film is helpful to improve the adhesion strength.
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