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Research On Fabrication Of ITO Glass Electrochemical Microfluidic Chips And Low Temperature Bonding

Posted on:2009-09-11Degree:MasterType:Thesis
Country:ChinaCandidate:N QiFull Text:PDF
GTID:2178360278453405Subject:Mechanical Manufacturing and Automation
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Microfluidic chip, widely used in biology, chemistry, medicine, food, agriculture and other fields, is research focus and hot spot of u-TAS (Micro Total Analysis System). Glass is one of the most popular material of microfluidic chip, because it has excellent permeability, optical and surface properties, small micro-channel heat distortion, easy to modify surface, etching technology and surface modification are mature, traditional capillary electrophoresis technology can be directly applied to glass chips. The traditional glass microfluidic chip which has a meetly long production cycle and low production efficiency is expensive, need complex and expensive equipment, and its development and spreading are restricted. This essay mainly developed a glass microfluidic chip manufacturing technology which integrated a electrode on it. The work chiefly includes:The manufacturing of ITO electrode: On the basis of the existing lithography process, ITO electrode manufacturing process is established in our laboratory.The production of Micro-channel on glass: the process to etch channel on glass is quite mature now. In this paper, the impact of solution and stirring speed on roughness of the channel surface is studied simply.Low temperature bonding with a intermediate of PE film: the parameters of the bonding process is established, the effect of bonding temperature, pressure and time on the block is analyzed by taguchi method; and the bonding strength and performance of the chip are tested. Creep curve of PE film under a constant temperature is obtained, and three different mechanical models are used to fit the creep curve. The film deformation in the bonding process is simulated, and the result reveals that the model is corresponded with the experiments. The block is simulated in terms of different channels, the conclusion is that, the block rise while the channel width rise.Low temperature bonding with a intermediate of EN film under a vacuum circumstance: Through taguchi method, the effect of bonding temperature, pressure, and time on the block of the PMMA chip is analyzed, which is made with this process. The bonding strength and performance of the glass and PMMA chip are tested, as a result, the chips has enough bonding strength and excellent performance. Get the viscosity of EN by rheological experiment, established the Maxwell model of EN film. The film distortion cased the block in micro-channel is simulated; the result is corresponded with the experiments. Then, the relations between the channel width and the block and the relation between the block and the chamfer angle of the channel are researched by FEM, and expected the block of glass chips made with this bonging technology.
Keywords/Search Tags:ITO electrode, Low-temperature bonding, PE film, EN film, MARC viscoelastic simulation
PDF Full Text Request
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