Thermal Shock Buckling Of A Coupled Thermoelastic Functionally Graded Circular Plate

Circular plate is widely used in mechanical engineering, civil and structural engineering, micro electromechanical system(MEMS), sensors, air devices and other fields. These structures will be subjected to the thermal shock in certain circumstances. Stability analysis of these structures is needed in order to ensure the safe use. The critical buckling loads and buckling modes will be calculated to control the failure induced by deformation. Taking into account thermoelastic coupling effect, the analysis of the stability of circular plate under thermal shock is significant important in engineering application. The dynamic thermal buckling of thermoelastic coupling functionally graded circular plate subjected to the thermal shock are studied in this dissertation. Details are as follows:On the basis of the classical theory of plates, considering the thermoelastic coupling effect, the dynamic thermal buckling characteristic of functionally graded circular plate subjected to the thermal shock are studied. The materials properties of the functionally graded materials are assumed continuously change by expontial function along the direction of the thickness coordinate according to the classical law of mixture model. The bottom surface of the circular plate is subjected to uniform thermal loadings, Dynamic temperature field of circular plate is solved which based on coupled heat conduction equation, and using the method of small perturbation to obtain the critical buckling temperature. The influence of the material gradient parameter, geometry ruler and the parameter of thermal shock load on critical heating load were discussed. In addition, built the basic equation and solving process of the above problems by finite element method.The results shows that the critical buckling temperature of coupling circular plate is higher than that of the uncoupling circular plate, and the critical temperature decreases with the increase of the ratio of radius and thickness. For this article considering thermal shock loads, the critical temperature of functionally graded circular plate decreases with the increase of the volume fraction of the material, and the values of critical temperature load were between ceramic and metal. Given the different load parameters and geometric parameters, the critical temperature decreases with the increasing of load parameters, but when the load parameter was larger, it had little effect on the critical temperature. In addition, the critical temperature increase with the decrease of load time, and trends to be a constants when the time was long enough.The results of this paper is significant for research the thermoelastic coupling of thermal shock functionally gradient material structure, and have some theoretical guidance for the engineering application and optimization design of functionally gradient composite materials.