Design And Numerical Simulation Of Thermal Field For Polysilicon Ingot Furnace

In addition to the mechanical transmission with smooth and convenient watersupply device, vacuum and automatic control system, the key for a good polysiliconingot furnace is to have a reasonable thermal field. As the core of ingot furnace,which plays a vital role for solid liquid interface and melt flow of polysilicon indirectional solidification process, and the heater, insulation layer, the crucible andother parts constitute the main components of the thermal field, therefore, can beadjusted by optimizing the design of the heater, insulation layer, the crucible andother components to modulate the directional solidification process.Firstly, made a simple introduction to the theoretical basis and the impact of themechanism of thermal field, followed by Shanghai Chen Hua model ZG-5Dpolysilicon ingot furnace for reference, then choose the crucible as design criterion,aim at make the selection of materials, optimization design and checking calculationto the main components of the thermal field (including: heaters and insulationlayer)from inside to outside. The main purpose of the design is to expect acquire amore reasonable thermal field and temperature gradient distribution, but also providea reference for the future development of a highly efficient ingot equipment.Finally, in order to test the rationality of the design of crucible or thermal field,validated the distribution of silicon melt thermal and flow field using inverted conicalcrucible on the basis of optimization design, meanwhile elect convex and circularcrucible as contrast by using Comsol Multiphysics simulation software. Studies haveshown that, compared with the other two crucible, inverted conical crucible canreceive more uniform thermal field, and the solid liquid interface is more level, so itcould preparation of high-quality polysilicon ingot. It means that a certain inclinationcrucible is more suitable for thermal field, it also indicate the results of thepreliminary design of the third chapter on the thermal field in line with the designrequirements.