Research On The Electric And Thermal Properties Of Composite Films Used By Resistor Arrays

This paper focuses on the development direction of the resistorarrays dynamic infrared scene projector，researches the measurementmethods of thin film’s density, resistivity at high temperature andmicro-bridge composite film’s thermal conductivity, heat capacity. Ithopes to get properties of some kinds of thin film materials, thenprepares for the development of follow-up devices. So that it can shortresearch time and save development costs.Firstly, this article describes the background of the developmentand application of the resistor arrays, gives the basic physicalparameters of film materials what are needed to improve performance ofdevice.Secondly, it researches a set of workable experimental solutionsfor weighting film. It measures the density of polycrystalline Si, SiO2,SiN, TiN films successfully.Thirdly, it describes the principle of Rymaszewski’s formulas forfour-point probe method to measure thin-film resistance. Design andbuild a four-point probe method system that can measure thin-filmresistance at the temperature from normal atmospheric temperature to500. It measures the temperature coefficient of resistance ofpolycrystalline Si, Pt, TiN film from room temperature to hightemperature. Most results have a good fit with the literature referencevalues.At last, it discusses the experimental principle of steady-statemicro-bridge measuring the thermal conductivity of thin films andmicro-bridge calorimeter measuring the heat capacity of thin films.According to the principle and process requirements, it designs six categories of test structures, and gives the preparation process ofall types of structures.