Preparation Of Two Novel Phosphorus-Silicon Flame Retardants And Performance Of The Hybrid Materials

With the rapid development of the3C industry, miniaturization and diversification is the new direction for electronic components. Conventional FR-4epoxy-based CCL has been unable to meet the current needs of science and technology, for which the need for a new fire-retardant, heat resistance, low dielectric properties of high-performance resin matrix to replace the traditional copper-clad laminate. We learned from practical way, prepared two new P-Si additives and characterize its chemical structure. After using them modified EP resin, we study the curing process, as well as its impact on the main performance of the CCLThe new P-Si retardant M-POSS is synthesized by octavinyl POSS, DOPO, mercaptopropionic acid with a POSS molecule connected to four P atoms, the synthesis process for each new substance using infrared and NMR characterization. After using its modified epoxy, we study the properties of hybrid materials through DSC, TGA, SEM, LOI, UL94v, LCR and contact angle test. When M-POSS added to the resin matrix, their Tg have increased, the dielectric constant decrease, anti-water absorption and flame retardant performance reinforced, thermal decomposition mechanism has not changed much compared with the pure resin matrix material. After the insertion of3%M-POSS, the system can achieve UL94V-0, LOI value of the maximum upgrade to35.8that the residual char content increases from11.13%to19.53%. The glass transition temperature (Tg) in the system reached136℃for inserted5%M-POSS. The contact angle to water of hybrid materials improve from87°to maximum111.77°. When adding5%M-POSS, the dielectric constant is reduced from3.71to3.34.The flame retardant C-POSS was prepared from MAPOSS, IPDI, DOPO with a POSS molecule connected to a P atom, the synthesis process for each new substance using infrared and NMR characterization. After C-POSS/EP hybrid materials were prepared we study its properties through DSC, TGA, SEM, LOI, UL94v, LCR, contact angle test. Because of the similarity of two POSS molecule, their performances are generally the same. In the contrast,M-POSS/EP hybrid materials are much better than C-POSS/EP materials except dielectric property. When adding5%C-POSS to epoxy resin, the dielectric constant decrease to3.13. Comparison of these two flame POSS, comprehensive performance of M-POSS/EP hybrid materials is superior.