The Polycrystalline Diamond Cutting Tool Grinding Process Parameters Optimization And Grinding Mechanism

The polycrystalline diamond (PCD) is applied widely in industrial fields as a new cutting tool material of high hardness and good wear-resistance. But its superhardness and high wear-resistance make it difficult to be grinded with the high grinding cost and low grinding efficiency and this restricts its popularity, therefore, how to improve grinding efficiency and lower grinding costs is an important and difficult job.Through experiments, the effects of grinding process parameters on the grinding forces, removal rate and G-ratio when grinding PCD are studied. Furthermore, the mathematic models of the effects of wheel speed, contact force and feed on grinding forces, removal rate and G-ratio are constructed by means of regressive analysis. Moreover, the good process parameters of higher grinding efficiency and lower grinding costs are obtained through the mathematic method and the selecting principles of grinding process parameters on several typical conditions are gained.On the other hand, the PCD grinding mechanism is clarified by analysing the surface image of grinded PCD through SEM. It is indicated that the synthetic actions of forces and heat are the main removal mechanism on PCD grinding, including mechanical removal, brittle fracture, graphitization and plastic deformation.Finally, the effects of process parameters on PCD grinding are analysed by the grinding mechanism obtained in this paper and the grinding mechanism is verified through some phenomena.