Rapid Solidification Of The Preparation And Properties Of Amorphous Cu-P Solder

The 1#~10# Cu-P series brazing ribbons have been made from some kinds of well-performed substitues for silver solder using rapid solidification technique in air. The contents of Ag were reduced under assuring capability of filler metals.The craftwork processes of making Cu-P, Cu-Ni-P and Cu -Ni-Sn-P series brazing ribbons were analysed and confirmed with reason in the thesis. The relation of the alloy element and the glass formtion ability and wettability of filler metals and the effect of substitues for silver solder and the change of tensile strength when adding Sn and Ni respectively or together were studied particularly by the method of DTA, SEM, X-ray, and so on. At the same time, the rupture action of joint was discussed.Mechanical strength of joint and melting feature of Cu-P alloy ribbon were studied respectively. The research shows that the tensile strength of joint decreases when the content of P increases, however, the tensile strength of joint increases when the content of Ni increases. The improvement of wettability and tensile strength of Cu-P base filler metal can be achieved by adding a right amount of Sn,Sn and Ni.Glass formtion ability of Cu-P alloy ribbon was studied and discussed. The result shows that the glass formtion ability of copper-phosphorus base filler metals can be improved by adding a right amount of Sn or Ni, when content of P does not change. Moreover, the effect of the glass formtion ability of copper-phosphorus base filler metals when adding a right amount of Sn and Ni together is better than the effect when adding Sn and Ni respectively.