| Tungsten-copper composites have been widely used for thermal managing applications such as microelectronic devices, microwave materials and heavy duty circuit breakers because of the low thermal expansion coefficient and the high resistance to welding and to arc corrosion of tungsten and the high thermal conductivity and the thermal expansion coefficient of copper. To near-net-form complex parts has drawn extensive interest in the field of Powder Metallurgy, W50Cu and W70Cu materials with a complex "cup" shape manufactured by warm flow compaction were studied systematically. In the present paper, The effects of the type of copper powder(atomization copper powder, electrolytic copper powder and ultra-fine grained copper powder), content of the binder, and shaping temperature on porosity distribution were investigated. It was shown that, complex figure W50Cu parts with homogeneous porosity distribution can be obtained at 75～85℃, with addition of 28.5vol%～32vol% binder. And the complex W-skeleton with a homogeneous porosity distribution can be obtained with 35vo1% binder addition and high temperature for compaction. Meanwhile, different types of copper powders with different particle sizes and surface morphologies greatly affect the porosity distribution of the complex W-skeleton. The W-skeleton with a homogeneous porosity distribution can be obtained at 55℃, as the ultra-fine copper powder with smoother and regular surface was used as a copper source and 35 vol% binder was dispersed in the powder composite. As a result, a uniform density distribution and a density of 14.2g/cm~3 (R.D 99.0%) of the composite can be achieved by infiltrating at 1200℃for 30min.Two different liner shape charge (W50Cu, W70Cu) were manufactured by warm flow compaction. The results show that the liner shape charge with extremely fine homogeneous porosity can be obtained by warm flow compaction. The penetration depth of W50Cu charge can reach 755mm. 17% more than the charge of the slccnpc. |
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