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Deposition Of Particle Energy Of Ti / Tin Film Growth And Performance Impact

Posted on:2010-03-31Degree:MasterType:Thesis
Country:ChinaCandidate:H HuangFull Text:PDF
GTID:2191360278476467Subject:Nuclear Fuel Cycle and Materials
Abstract/Summary:PDF Full Text Request
The technology of energetic particles deposition is a very useful method to improve film macro-properties by increasing energy of all or part particles.In this work,aimed at the corrosion protection of U-Ti alloy,the effect of particle energy on the growth and properties of Ti/TiN film was studied in theory and experiment.The form and peak value of negative bias voltage are two important factors that affect film quality and properties,the effect of the form and peak value of bias voltage on film nucleation,cross-section condition and substrate deposition temperature was studied with molecular dynamics firstly.The incident energy could be improved by increasing the peak value of bias voltage,the nucleation number increases and the nucleation distribution region expands with the particle energy,which can benefit the refinement of crystalline and layer-by-layer growth of film,but the density and deposition rate could decrease owing to the enhancement of sputtering and destroying effect caused by incident atom with high energy.In addition,the enhancement of interaction between island and substrate surface,the decrement of cross-section stress and the improvement of film-substrate(F-S) bonding force could be caused by increasing deposition particle energy.The substrate deposition temperature could be affected by the form of bias voltage,the peak value of impulse bias voltage is higher than that of direct currency bias voltage in general,the time of interaction between incident atom and substrate surface can be controlled by adjusting duty ratio,this insures the high temperature and pressure in micro-area of cascade connection body and keeps the whole substrate temperature low,so the crystalline is refined and the F-S cross-section stress is relaxed.On the base of theoretic analysis,considering the advantage and disadvantage of the bias voltage peak value and combining with relative experimental results,-400—-800V impulse negative bias voltage was chosen and Ti/TiN films were prepared on the U-Ti substrate by multi-arc and magnetron sputtering combined ion plating and single magnetron sputtering ion plating,SEM,XRD,AFM,friction testing and electro-chemical corrosion were used to analyze the structure and properties of film.The results show,comparing with single magnetron sputtering ion plating, although,the surface roughness and crystalline size of film prepared by multi-arc and magnetron sputtering combined ion plating increase,the better Cl~- corrosion resistance property of Ti/TiN film is got by optimizing bias voltage.In multi-arc and magnetron sputtering combined ion plating,the average crystalline size and micro-strain of film could be affected by the peak value of impulse bias voltage.The properties of friction and Cl~- corrosion resistance decrease with the increment of bias voltage in magnetron sputtering deposition process when bias voltage is -500V in multi-arc deposition process.The friction property increases and the Cl~- corrosion resistance property decreases with the increment of bias voltage in magnetron sputtering deposition process when bias voltage is -800V in multi-arc deposition process.In multi-arc and magnetron sputtering combined ion plating,the size and number of macro-particle decrease,the F-S bonding force and the Cl~- corrosion resistance property increase with the increment of bias voltage in multi-arc deposition process under the same bias voltage in magnetron sputtering deposition process.
Keywords/Search Tags:multi-arc and magnetron combined ion plating, negative bias voltage, particle energy, molecular dynamics, embedded atom method
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