Experimental Study Of Thermal Boundary Resistance Between Copper And Stainless Steel With Modulated Photothermal Method At Low Temperature

At low temperature,the heat transfer between two contact bulks determinates the reliability and life of apparatus. Copper and stainless steel materials are commonly used in engineering. This thesis focuses on thermal contact resistance of Copper and stainless steel interfaces, does research work to explore its microcosmic mechanism with regression analysis, model simulation, theoretical analysis method. Modulated photothermal method was used in this experimental study.This topic is a national natural science funds(50876034), Based on our former experimental studies, Modulated photothermal method experimental mechanism and its application conditions are further studied, Modulated photothermal method experimental system and equipments for cooper-aluminum nitride thermal contact resistance are designed, at a contact pressure range from 0.23MPa to 0.68MPa,at a temperature range from 70K to 290K,In this paper, we found the limitations of Steady state by analyzing the steady-state thermal resistance measurement error of the contact interface.Contact interface resistance were measured with the variation of temperature and pressure,Based on the experimental data,we found he contact interface resistance decreases with rising of the contact pressure and temperature.the coupling effect between the temperature and pressure on solid contac was found of interface thermal resistance, by comparing different regression models.Samples used in this study are metal materials, the hot carrier conditions was analysised on the basics of 3D micro-structure contact interface layer concept. model was established for the hot carrier is electronically,The prediction model of electron-phonon coupling into consideration was proposed when the temperature is below 20K.