The Research Of Curing Mechanisms And The Reaction Kinetics Of Epoxy Resin Electron Embedding Material

Epoxy resin which has outstanding dielectrical property, mechanical property electrical insulation, strong bonding power, low shrinkage and good stress transfer has been widely used in the field of electron, electricity, aerospace, aviation, machine building, and so on. It had played a decisive role in its history of last 70 years. In recent years, more and more researches of applied technology of epoxy resin have been involved in order to meet the practical application requirements.At present, epoxy resin electron embedding material as matrix material applied in the integrated circuit which has long pot life, high heat deflection temperature, light color of curing and good electrical property is developing quickly. However, high curing temperature is needed when acid anhydride is chosen to cure epoxy resin, though it will have excellent curing performance. Therefore, how to achieve the low curing temperature is a real big challenge.In this article, for the purpose of lowering the curing temperature, epoxy resin was chosen as the matrix resin, methylnadic acid anhydride was chosen as the curing agent, carboxyl-terminated rubber was chosen as the flexibilizer, acetylacetone chromium salt was chosen as the accelerator. In order to research the curing mechanisms, IR and XPS were employed to analyze the sample before and after curing. The results showed that the cure reaction of the matrix resin was not a single reaction, epoxy resin would homopolymerize with the acid anhydride curing agent, and getting homopolymer containing ether bond and ester bond. In addition, the valence state of chromium in the acetylacetone chromium salt was changed from trivalence to divalent. The toughening mechanisms of the CTBN were explored via the shear strength and the fracture surface obtained with scanningelectron microscope of epoxy resin electron embedding materialWith the combination of thermogravimetric analysis and Coats-Redfern Method, thermal degradation kinetic parameters including reaction order n, collision factor A, activation energy E of curing the epoxy resin electron embedding material with different levels of acetylacetone chromium salt were calculated. Moreover, with the use of differential scanning calorimetry, starting temperature, peak temperature and final temperature of the curing reaction were obtained. Then the curing process was determined that 120℃1 hour, then 150℃1 hour, then 180℃2 hours, then 220℃4 hours. Kissinger and Flynn-Wall-Ozawa extremum method were used to get the apparent activation energy Ea, pre-exponential factor A and the reaction rate constant K. Combining with Crane formula, the reaction order was obtained. The results show that adding an appropriate amount of accelerator can be effectively reduled the activation energy ,which accelerates the curing proless.