Research On Deposition Of Miniature CVD Diamond Heat Sink

CVD diamond film is an excellent engineering material，for which it is the best candidate formicroelectronics heat sink application. Diamond, especially the miniature CVD diamond heat sink isdifficult to cut because of its hardness and brittleness. To solve this problem, a mold copy method wasproposed to fabricate the miniature CVD diamond heat sinks, the main works in this thesis arepresented following:1. The gas flow and temperature field for miniature CVD diamond heat sink deposition wassimulated. The influence of the gas flow rate, the filament arrangement and filament temperature onthe gas flow and temperature field was analysized. The deposition condition suited to the miniatureCVD diamond heat sink deposition was brought up.2. The experiment to deposite the miniature CVD diamond heat sink was carried on. The siliconmolds suitable for miniature CVD diamond heat sinks were manufactured with ICP technology. Thediamond heat sinks were deposited in the silicon mold cavities by HFCVD method. Diamond heatsinks with good figure, size and surface appearance were obtained by the precisely controlling of thedeposition parameters.3. The thermal conductivity of the prepared diamond heat sinks was measured. The thermalconductivity of the heat sinks was detected. The result indicates that the heat sinks deposited by thetechnology suggested in this thesis have good thermal conductivity. The reason of the attenuation ofthermal conductivity of CVD diamond heat sink was analysized.