Thermal-Structure Coupling Numerical Simulation Of SiC_foam/Al Co-Continuous Composites

Co-continuous composites is a new, multi-functional composite materials, the matrix andthe reinforcement are3-D and continuous structure make it has excellent mechanicalproperties, thermal properties, the ability of resistant friction-wear and vibration reductionperformance. Therefore, it is necessary and significant to make a deeply investigation.In this paper, Kelvin model was selected to simulate the foam metal and thereinforcement of Co-continuous composites. Brake disc and electronic packaging were madeby SiCfoam/Al composites were simulated to analysis mechanical properties and thermalproperties through running thermal-structure coupling based on ANSYS. The results showedthat at the same of volume fraction of the reinforcement, not only the temperature distributionof SiCfoam/Al composites is more uniform than SiCp/Al, but also the heat exchange propertiesand the heat output properties are better than SiCp/Al. After heating to certain temperature, theelastic modulus and yield strength of the Co-continuous composites is220%and8%largerthan particles reinforce composites’, the ability to against deform of SiCfoam/Al compositesincrease with the volume fraction increasing；and after cooling to room temperature, theelastic modulus and yield strength of the Co-continuous composites is230%and41%higherthan SiCp/Al’s, and the elastic modulus and yield strength of forced cooling is12%and12.6%higher than natural cooling; the stress is the highest in the interface of the composites, and itwas influenced by thermal expansion largely, it increase with the thermal expansionincreasing.