The Activator Of Copper Electroless Plating In Pirnted Circuit Board Development Of Colloid Palladium

As a result of the rapid development of high-tech industry，such as the computerand communications. It provides huge room for chemical copper plating technology inPrinted circuit board （ PBC ） industry. Colloid Palladium activated liquid is the mostwidely catalyst in the Electroless copper plating industry, especially in the applicationof PCB hole metallization. In this paper, by studying the effect of preparation methodsand preparation conditions of salt-based Colloid Palladium on the activity andstability,we makes excellent performance of Colloid Palladium. In this paper,throughthe determination of triggered cycle namely induction time,completely platingtime,mixed potential time method and effect of plating copper determined ColloidPalladium activity; Through the determination of placed180 days under function ofultrasonic wave activating liquid copper effect, stability analysis. By studying theeffect of preparation methods and preparation conditions of salt-based ColloidPalladium on the activity and stability,we makes excellent performance of ColloidPalladium,and the optimization of preparation conditions of salt-based colloidpalladium.The results obtained are as follows:1. With palladium chloride concentration increased, the activity of colloidPalladium increases, palladium chloride concentration is 2.5g / L; The reaction time,reaction temperature, reaction temperature on the base of colloid Palladium activity isaffected. As the reaction time increases, colloid palladium activation activityincreased first and then decreased, experiment to determine the reaction time of 8min;With the increase of the reaction temperature, base of colloid Palladium activityincreases first and then decreases, the experimentally determined the reactiontemperature is 20³5℃;Along with the aging temperature increasing, ColloidPalladium activated liquid activity increases, but the curing temperature of 60to⁸0℃,colloid Palladium activity did not significantly improve, the selected curingtemperature of 55℃. Stannic acid sodium concentration, Sn / Pd （ molar ratio ）, theconcentration of sodium chloride on the base of Colloid Palladium activity of smalleffect, but the influence of Colloid Palladium stability. With the increasing ofconcentration of sodium stannate, Colloid Palladium stability time increases, whenthe concentration was increased to 5.0g / L, Colloid Palladium stability time constant,so the tin sodium concentration is 5.0g / L; Along with the Sn / Pd increasing, ColloidPalladium increased stability, when Sn / Pd = 50, can meet the requirements ofindustrial production; with sodium chloride concentration increasing, the stability of Colloid Palladium increases first then decreases, after, ultimately determine thesodium chloride concentration at 175g / L. Influence of methanol on PD colloidsactivity and stability to produce adverse effect.2. The better condition for preparation of salt-based Colloid Palladium：PdCl₂ for2.5g / L, Sn / Pd is 50:1, NaCl to 175g / L, tin sodium concentration is 5g / L,reaction time 8min, reaction temperature 20³5 C, reaction temperature55degreescelsius.3. Using ultrasonic action while the prepared Colloid Palladium activity andstability is better than no action of ultrasonic activation solution. The effect ofultrasonic time is 0²0min, along with the ultrasonic time increased, configuration ofColloid Palladium in a short time, increase the activity of copper, good effect,subsequent ultrasound effect down. The effect of ultrasonic of Colloid Palladiumactivation solution at 180days still maintains high activity, good stability.