The Preparation Of High Conductivity Of Silver Conductive Adhesive And Low-cost Research

As an electronic interconnect materials, conductive adhesive wasmore and more used in surface mount and chip interconnect with therapid development of electronic technology. As a substitute of traditionalSn/Pb solder, Conductive adhesives had many good qualities, such as alow temperature, a simple process and environment-friendly. However,there were many shortcomings for conductive adhesive in practicalapplications, the low volume resistivity and high cost restricted theapplication. Therefore, the preparation of highly conductivity of silverconductive adhesive and low-cost research became the focus of thestudy.First, a highly conductive silver conductive adhesive was prepared,and on this basis, we developed a silver plating copper conductiveadhesive. We studied the main factors of affecting the volume resistivityand shear strength of the conductive adhesive, and obtained the basiclaw of the conductive adhesive. Main research contents were as follows:(1) The silver conductive adhesive was prepared by choosingdifferent types of epoxy resin, curing agent, catalyst, silver powder,additives and toughening agent. A reasonable curing procedure wasdetermined by differential scanning calorimetry (DSC)．The theoreticalamount of the curing agent was determined by infrared spectroscopy(FT-IR), Micro-mophorlogy of silver fillers and the cured morphologwas observed by scanning electron microscopy (SEM). The key factorsand effect of affecting the volume resistivity and shear strength werestudied. their distribution in the cured conductive adhesive wereinvestigated by SEM. the key factors and their effects on the conductiveperformance，adhesion strength were studied．The results showed thatthe best ratio of epoxy resin and curing agent was25:5. The conductiveproperties of ICA was best when selecting mixed silver, which was theMSP-07: PSP-04=1:5, and the addition was75%. We used organicdicarboxylic acid Better results than triethanolamine on the handle withsilver powder, the volume resistivity of malonic acid was 5.372×10-5·cm. Anti-oxidant determined conductive properties of theconductive adhesive, coupling the second, defoamers Third, malonateminimum by orthogonal experiments. The impact of tensile shearstrength, coupling was the maximum, defoamer followed, anti-oxidantthird, malonic minimum. ETBN can reduce the electrical properties ofconductive adhesives but increase the shear strength obviously, itreached addition of15%, Maximum was7.112MPa.(2) Based on silver conductive adhesive, the silver plating copperconductive adhesive was prepared by using silver plating coppe powder.before and after treated silver plating copper and ETBN tougheningmodification were observed by scanning Electron Microscopy (SEM). Areasonable curing procedure was determined by differential scanningcalorimetry (DSC). The results showed that volume resistivity of theconductive adhesive was best when silver content in the silver platingcopper powder was of25%, the dosage of the total mass was75%andThe silver was distributed by coupling agent KH-550, it reached6.107×10-4·cm. The coupling agent’s wallet copper powder, SEMresults show that The dispersion of the powder handled by couplingagent had been greatly improved by SEM. Diethylene glycol monobutylether could improve the conductivity and The terpineol could reduce thefineness of the conductive adhesive In a mixed solvent and The bestratio between85:15, mixed solven reached70%of the epoxy resin.ETBN can increase the shear strength obviously, it reached addition of15%, Maximum was14.593MPa, but it reduce the electrical propertiesof conductive adhesives.