Preparation And Reaction Mechanism Of Ammonium Perchlorate Filled Porous Copper

The hydrogen bubble template method was applied, using a mixed solution of copper sulfate and sulfuric acid as the electrolyte. The hydrogen bubbles produced in the side reactions are the template to prepare porous copper film. The SEM and LSCM were applied to characterize the porous copper. It is found that the porous copper has sponge-like structure and the walls are composed of different scales of copper crystallite, which makes the porous copper has a high specific surface area and porosity. This experiment is focused on the impact of different types and concentrations of additives on the morphology of three-dimensional structure of the porous copper to determine the optimum amount of additive. The saturated solution of ammonium perchlorate in acetone was added to the surface of the porous copper to prepare the NH4ClO4and porous copper composite materials. SEM and XRD were applied to characterize the filled porous copper and it is found that the filled porous copper becomes more dense and the dark gray material attached to the walls is NH4ClO4.TG-DSC-MS-IR was employed to conduct the thermal analysis of the porous copper and NH4ClO4composite materials to show the reaction mechanism, especially the catalytic mechanism that the porous copper shows on the thermal decomposition of NH4ClO4. DSC and XRD were applied to consider the reaction process of the composite materials, and the concluded thermal decomposition reactions of the porous copper and NH4ClO4composite materials is as follows:6NH4ClO4+4Cu→2CuCl+2CuO+3N2↑+12H2O↑+2Cl2↑+5O2↑The electron transfer and proton transfer theory are employed to interpret the enhanced catalytic properties of porous copper with a larger specific surface area and unsaturated condition. In the process of thermal decomposition reaction, the key catalytic role is CuO produced by the porous copper and NH4ClO4. In the thermal decomposition process of NH4ClO4, CuO played a very important bridge-type catalytic role, in which the low valence oxide valence band achieves cavity annihilation by accepting the transfer of electronic to promote the thermal decomposition of NH4ClO4.