The Research And Development Of Gold Ball Wire Bonders Bond Head

Wire bonders bond head is fully automatic wire bonders one of the core components, which contains part of the Z-axis and Z-axis movement of the fixed part, and its performance has a direct impact on the stability of wire bonders and solder wire quality, thereby affecting the reliability of the chip. In order to meet the current high-speed precision wire bonders acceleration requirements, the entire wire bonders bond head inertia of moving parts must be small, the natural frequency is demanding, the impact on the chip is small, position control and force control accuracy requirements high, and the current wire bonders used XY linear stage, the performance of its high-speed high-speed direct bond head in the XY direction stiffness have certain requirements.In this paper, bond head for a more systematic structural design, analysis and research, including structural design, the support is driven motor selection, according to the fatigue design and stiffness required to select a portion of the Z-axis motion supporting flexible hinge; raised wire bonders bond head design ideas and methods to determine the bond head design, and detailed design according to the design plan, drawn wire bonders bond head model, based on this analysis bond head wire bonders static and dynamic characteristics, which include static characteristic bond head static analysis, dynamic characteristics including modal and impact properties. And research bond head concentricity issue, set the tolerance index; utilize abaqus/CAE technology to complete the bond head dynamic performance and static performance of the simulation, which includes dynamic performance bond head crash simulation and modal analysis, static analysis included in the XY bond head high speed, high acceleration cases, analysis of the fixed part of the Z-axis motion intensity; under bond head, fast response, high accuracy, chose to use a voice coil motor, this motor is stable, fast features to meet the requirements of the bond head, achieve high-speed high-precision results; finally prototype above, through the elevation Biaoli bonding experiments and direct-drive head position-power switching control experiments bond head structure design verification. Direct drive bond head under the operational features, a single power stability, afterburner exact time, no major fluctuations in power switching, volatility error band of+10g, impact and rebound force is less than the allowable range chip. Position curve in matlab draw force curve and achieve business requirements.After loading the prototype, the related debugging and related modifications, and through repeated testing, through high-speed camera view wire bond head case, appear disconnected, solder joint failure, wire welding biased rarely, and from the previous Single10K raised to18k, production has been a lot of improvement reflects this bond head high precision, high stability characteristics, are thus also proved this bond head of the mechanical structure design is reasonable.