Dynamic Performance Optimization Of The Thermal Equivalent Device Based On The Integrated Power Electronic Module

The rise of integrated power electronics technology, making the integrated power electronic device design and maintenance more convenient, integrated power electronic devices in practice more widely.However, with improved integration of power electronics, heat flux density is increasing.Efficient cooling of power electronic devices has become integrated in the process of common technical problems.Heating areas consistent with the actual power electronics devices--Thermal equivalent device is the study of the necessary equipment and efficient cooling technology.Integrated power electronic module ideal thermal equivalent device, in the steady state and dynamic characteristics should be consistent with the actual module.In this thesis topic before, our group has proposed a power electronic device integrated module thermal equivalent technical programs and give basic realizationThe program, through heater power control and motion control scientific cooperation, the actual power electronic components approaching the true thermal state.This paper aims to further optimize the device’s performance, enhance its steady precision, especially to improve its dynamic performance.Power electronic components for the current range of capacities, through access to information, theoretical analysis and experimental, establishing integrated power electronic module state thermal modelThe simulation analysis integrated power electronic module thermal dynamic characteristic curve;The curve is a further system analysis, system integration, system control objectives.In this paper, thermal equivalent device measures proposed to improve the hardware configuration.Using MATLAB simulation comparison of two different control methods to control effects, improved control strategies to improve the system integration module for power electronics thermal dynamics simulation accuracy.By calibration experiments to verify the accuracy of thermal equivalent device;Carried out before and after the thermal equivalent means improved performance comparison test;With use of the thermal equivalent means research group developed a micro-channel liquid cooling board test system of two different micro-channel structure of the heat radiation substrate was tested to obtain two kinds of heat dissipation effect of the merits of the substrate.This topic is designed thermal equivalent devices in a variety of efficient liquid-cooled heat sink substrate during the development of power electronics used in place of a real module, thereby reducing the experimental complexity, reduce the cost of experiments.