The Research On Acrylate Uv-Curing Kinetics And Photoresist For PCB

The acrylate UV-curing kinetics was researched by UV-DSC.The influence of photoinitiator, oligomer, monomer, filler SiO2and temperature, light intensity, time, oxygen inhibition on UV-curing was investigated.On the basis of the study on UV-curing kinetics, the photoresist for PCB was made. the effects on adhesion of UV-curable coating on aluminum was investigated. And the etching in acid or alkali was evaluated.The conclusions for all research are following:(1) The speed of UV-curing can be evaluated by comparing the time of maximum UV-cuing rate,the time when curing speed grow fastest and induction period.(2)The effect of Filler SiO2on different UV curable system is different. The effect of SiO2on the UV-curing speed and conversion of epoxy acrylate UV curable system is bigger than that of urethane acrylate UV curable system,which is related to the stiffness of the molecule structure.(3) Oxygen inhibition can be remitted by introducing ethyoxyls. Oxygen inhibition is related to the number of α-H and monomer viscosity.(4)The model of the UV-curing kinetic of aliphatic urethane acrylate CN8004UV curable system was calculated as R=[k1+k2(1-C)m](5)The spreadability of the cationic photoresist is worse than that of the radical photoresist.The stability of the patterns is bad.For acrylate UV curable system, the oligomer with flexible molecule structure is likely to perform good adhesion on aluminum.monofunctional monomers lead better adhesion than multifunctional monomers.Acid or alkali resistance of photoresist is related to its adhesion on aluminum.Nomally,the better the resistance of photoresist is,the finer the aluminum wire is.The photoresist within oligomer6215-100and monomer MMA performs the best acid or alkali resistance on this research.