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Automotive Body-in-white Solder Joint Quality Ultrasonic Detection System Research

Posted on:2014-04-10Degree:MasterType:Thesis
Country:ChinaCandidate:C B HeFull Text:PDF
GTID:2251330425460161Subject:Vehicle Engineering
Abstract/Summary:PDF Full Text Request
The quality of body-in-white solder joint has a great influence on vehicleperformance, so the solder joint detection methods got a lot of attention by manyscholars. Solder joint detection methods are divided into destructive testing andnon-destructive testing. In actual applications, ultrasonic detection is widely used inthe field of non-destructive testing. The main way that ultrasonic detection applied tothe solder joint quality testing in the automotive industry is offline detection method.And ultrasonic detection equipments are rare in the country; general domesticautomobile engine factories are using imported equipments. In this paper, theultrasonic detection system applied to the solder joint quality has been studied.This paper introduces the background and source of research topic, puts forwardnew research ideas. Based on the performance of BIW, it researches on the detectionarea of ultra-sonic solder joint quality inspection, selects key detection area throughCAE tools, reduces the workload of the detection and optimizes the traditionaldetection methods. The application and development trend of non-destructive testwhich has a systematic exposition for the basic principles of the ultrasonic testing andrelated researches on the corresponding relationship of echo signal and solder jointquality, which uses eigenvalue of quantitative methods to evaluate the quality ofsolder joint, and laid a theoretical foundation for the subsequent ultra-sonic detectionsystem. Meanwhile, based on the basic research of ultrasonic theory and performanceof the body, this paper has research and design on the system hardware and design andsimulation on he analog circuit part of the system, whose core control module usesFPGA as the core of the lower machine and the PC as upper machine architecture,besides, the FIFO module of FPGA configuration and simulation is also introduced inthis paper. At the same time, this paper has In-depth study on AD samplingarchitecture of the system, uses single chip AD chip architectu re and waveletde-noising the AD sampling of signal treatment to improve the accuracy of the signal.This paper uses the USB3.0as a way of communication between upper machine andlower machine, meet the requirements of the data transmission. This paper ha s carriedon the preliminary planning software design, researches on the upper machine dataprocessing flow and settings on human-computer interaction system. In the process of completion of the paper, a large number of simulation andexperiment has done, and detection methods has optimized on the basic of ensuringthe performance of the vehicle body. The reliability of ultrasonic detection systemhas been verified. This paper provides some reference values for further follow-updesign and optimization of ultrasound detection equipment.
Keywords/Search Tags:Body-in-white, Solder joint quality, Ultrasonic wave, Wavelet denoising, FPGA
PDF Full Text Request
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