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Epoxy Resin Adhesives With High-Temperature And Study On Its Curing Reaction Kinetics

Posted on:2015-03-02Degree:MasterType:Thesis
Country:ChinaCandidate:X GuoFull Text:PDF
GTID:2251330428956518Subject:Chemical engineering
Abstract/Summary:PDF Full Text Request
As one kind of structural material, high performance resin matrix composites widely used in aerospace industry. With the development of the aerospace industry, the device quality is required lighter, better reliability, and better dimensional stability. Matrix resin’s heat resistance, toughness, wet, heat resistance, strength and resistance to chemical media and so on, are the key to the performance of composite materials. Epoxy resin is a kind of high performance synthetic resin, it has excellent adhesion, high dielectric properties, high heat resistance and mechanical properties, and it is unmatched by other synthetic resin, it has an irreplaceable role in the composite material industry. Now more strict requirements have put forward to the heat resistance of epoxy resin material, and to develop a high heat-resistant type epoxy resin is a very important and practical thing. TGDDM epoxy resin has good heat resistance and excellent adhesive properties, but it also has the poor toughness. In recent decades, the modified TGDDM epoxy resin can be used as carbon fiber reinforced composite matrix material widely in the aerospace field, so it has good development prospects.Under the high temperature, the more powerful resistance the epoxy resin adhesives with high-temperature has, the better heat resistance it has, but the greater the brittleness, brittle assembly reduce intensity. In this paper, we prepared one kind of polyfunctional epoxy resin with high toughness—DDRS polyfunctional epoxy resin firstly, to develop the toughness of TGDDM epoxy resin, which has be choose as the matrix resin. And then study on the properties of DDRS polyfunctional epoxy resin. After that, we prepared the high-temperature epoxy resin adhesive with adding curing agent, diluent and so on. Study on its curing reaction kinetic; compare severe different process to process optimization of it. Finally, we study on the properties of TGDDM epoxy resin adhesive, such as the mechanical properties, water absorption, viscosity, apparent activation energy, surface energy. And we also compared the TGDDM epoxy resin of different manufacturer production in the same conditions for the preparation of epoxy adhesives’ performance.The TGDDM epoxy resin adhesives we prepared have so good heat resistant performance, their tensile shear strength can reach15.6-18.6MPa at200℃. The activation energy is42-46kJ/mol; dielectric loss is about0.006can used as an insulation material; surface energy is between40-45mJ/m2, and the bibulous rate is below0.4%,which present good hydrophobic property.
Keywords/Search Tags:heat resistance, adhesive, epoxy resin, curing reaction kin
PDF Full Text Request
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