Mechanism Of Sn And In In Cu

In this paper, add a small amount of Sn and In elements in high purity copper to obtain Cu-Sn-In alloy.And studied Cu-Sn-In alloy with different content of Sn and In. By the observation of the microstructure, tensile testing, hardness testing, conductivity measurements, X-ray diffraction analysis, SEM and EDS analysis of its organizational structure, tensile properties and conductivity, the Sn and In in Cu effects of organizational performance, and an explanation in the theory were analyzed, and in theory be an explanation. Experimental results shows that:(1) Sn and In elements in the Cu matrix formed Cu3Sn and Cu11In9, the two were white particles dispersed in a Cu matrix very stably, and not changed with Sn and In elements increase or the hot and cold rolling. Sn and In joined both improved the tensile strength of pure copper, but the difference is that:with increasing Sn content, the tensile strength has been increased;with increasing In content, the tensile strength rise at first, when the In content higher than0.2%, the tensile strength began to decline.This experiment, the Cu-0.3Sn-0.2In alloy and Cu-0.2Sn-0.2In alloy in cold-rolled state show a good tensile mechanical properties were396.47MPa and387.39MPa.(2) Sn and In elements from the overall point of view reduces the conductivity of pure copper, and the content of Sn and In the higher, the conductivity decreased more. The difference is that, when the In content of less than0.2%, the conductivity decreased rapidly, the decline is slowing down more than0.2%. Sn is the opposite, Illustrates that the Sn content should not be too high. The conductivity of hot-rolled and cold rolled alloy, but hot-rolled slightly increase the electrical conductivity. Hot-rolled recovery of conductivity about1%, cold-rolled reduced conductivity by1to2percent.(3) Cu-0.2Sn-0.2In alloy showed a more balanced performance, tensile strength387.39MPa,78.77%IACS conductivity, so the composition is more reasonable.(4) Recrystallization annealing experiments by different degree of deformation of Cu-0.2Sn-0.2In alloy, the recrystallization annealing, the hardness, annealing temperature and degree of deformation between the mathematical model:In the formula:y is the Brinell hardness; x is the annealing temperature (℃); ε is the pre-deformation (%).(5) Cu-0.2Sn-0.2In alloy recrystallization temperature and pre-deformation between the basic exponential decay law, by fitting analysis of the interaction between a function of: T=479.26*exp(-ε/9.64)+220.39(6) Annealing temperature and pre-deformation are the main influencing factors for the Cu-0.2Sn-0.2In alloy, the holding time has little effect. Under our experimental conditions, Cu-0.2Sn-0.2In recrystallization annealing process is450℃×1.5h. Both to ensure a the recrystallization full, and it will not lead to grain excessively thick.