| In this paper, tetradecafluorohexane, perfluorodecalin,1H,1 H,2H-perfluoro-1-decene and perfluorobiphenyl acted as monomer, using Plasma enhanced chemical vapor deposition (PECVD) to deposited fluorocarbon films onto substrate. Static water contact angle of films were measured by contact angle measurement to analyze the hydrophobic properties, using Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS) to analyze the surface chemical composition and content, and then to observe the surface morphology of the deposited film by an Atomic force microscope (AFM), about studying the transparency of the film we chose UV-visible spectrophotometer (UV-Vis) to measure the transmittance of light in the 200-800 nm range, Surface Plasmon Resonance (SPR) technique used to measure the film thickness of the nanoscale is an effective means.Experimental results show 1H,1H,2H-perfluoro-1-decene (PFDE) is the best desired monomer, on the one hand due to a higher boiling liquid, it can provide a stable monomer flow rate at room temperature conditions, guarantee reactive power controllable. On the other hand due to the monomer contains more CF2 group, can improve performance of large hydrophobic functional group as a hydrophobic film. Different water contact angle of films that deposited at different discharge mode, at continuous wave mode were about 107°, and remained stable in 45 days. Under pulsed conditions WCA can reach 120°, the next day down to 112°, but with time and remain stable. By analysis infrared spectra and XPS spectra CF2 content under pulsed conditions is higher than under continuous wave mode. Content of CF2 is 54.5% in the fluorocarbon film with the deposition conditions for pulse discharge mode, the discharge power is 60W, Ton/Tof1=2 ms/75 ms. CF2 content 37.8% at continuous wave mode, the discharge power is 60 W. Experimental results of UV-Vis showed that when depositing a film thickness of 30 nm, the transmittance in the 200-800 nm range can reach 90% or more, the transmittance of light with increasing film thickness decreased. In the pulsed discharge conditions (Ton/Toff=2 ms/18 ms), the discharge power 60 W, a series of different deposition time to obtain a film of different thickness Simulation of the deposition rate under the condition is 1.0 nm/s. |