Research On The Reliability Of RFID Tag Packaged By Anisotropic Conductive Adhesive

Radio frequency identification (RFID) is a general term that is used to describe a systemthat transmits the identity (in the form of a unique serial number) of an object wirelessly. Withits advantages of non-contact identification, environmental adaptability, high reliability,repeatable read and write as well as the information can be encrypted, RFID has been widelyused in building security, production automation, logistics management and other fields. It iscurrently in the forefront, and the most concern of the industry key support technology,becoming the foundation the Internet of Things. Extensive, in-depth and worldwide researchfor RFID packaging equipment, manufacturing processes and integrate applications are beingundertaken driven by the enormous economic value and social benefits. In the industry andacademia, it is an urgent problem to develop the packaging technology and packagingequipment with excellent performance and inexpensive price. In this paper, the reliabilityissues of the RFID tags product and its influencing factors are studied, specific content can bedivided into the following several aspects:Firstly, research of the curing kinetics of anisotropic conductive adhesive (ACA) is thebasis for the optimization of bonding process. Differential scanning calorimeter was used toperform the quantitative tests of the curing process. Due to its methodological flaws of thetraditional model fitting methods, a method is called “Model Free Kinetics”(MFK) was usedto do the curing kinetics study of the ACA. In addition, the quantitative relationship betweenthe curing degree and the curing temperature and curing time was established.Secondly, according to the process parameters which may influence the tag’s reliability,such as curing degree, cure rate, bonding pressure and different temperature combinations ofbonding head, a series of process tests were performed to study of influence of processparameters on the product reliability, based on the criterion of shear strength and contact resistance.Then, in view of the bubbles and voids which can very often be detected in thenon-metalized area of the RFID tags, the thermo-gravimetric analysis of different ACA andantenna substrates were performed to explore the influence of component materials on thevoids imperfection. Furthermore, the voids growth under the high temperature (85℃) andhigh humidity (85%RH) conditions (so called85/85conditions) was performed to investigatethe influence of moisture on the voids imperfection.In this study, the effect of process parameters on the reliability of RFID tags productswere investigated, the formation mechanism of the voids imperfection related to thecomponent materials was discussed. The research results have been successfully applied inthe production of RFID tags.