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Preparation And Characterization Of Electroless Cu-based Ternary Alloy Nano Coatings

Posted on:2016-01-14Degree:MasterType:Thesis
Country:ChinaCandidate:Y D DengFull Text:PDF
GTID:2311330461988487Subject:Condensed matter physics
Abstract/Summary:PDF Full Text Request
Because the electroless plating Cu was widely used in electronics, communications and electrician industry and so on,the requirements of its property in corrosion resistance, heat resistance and adhesion becomes more stringent. Multi-component alloy nano coating has excellent physical and chemical properties, but the study of electroless plating Cu based multi-component alloys nano coating almost none. This paper studies the preparation and characterization of Cu based ternary alloy nano coatings. Electroless plating prepared Cu-Ni-P, Cu-Sn-P, Cu-Sn-B, Cu-W-P nano coatings. Analyzed the effects of concentration ratio of main salt, reducing agent concentration, complexing agent concentration, p H value and heat treatment on the coatings,and tested their surface morphology, composition and structure using SEM and XRD. The results show that:1. With the increase of the concentration ratio of main salt, the rate of the Cu-Sn-P nano coating frist sharply decrease, and then stabilized. The deposition rate is slower when total concentration of the complexing agent is too large, too small, and complexing agent is used alone. When the concentration of reducing agent is 0.3 mol·L-1 and the p H value is 13 can reach the ideal rate.2. In the acid bath, apparent corrosion points appeared at Cu-Sn-P nano coating. However there is no corrosion point and particles distributed evenly in the alkaline. Corrosion points contain large percentage of Sn, implying that Cu was firstly corroded when the corrosion begin.3. Agglomerates of Cu-Sn-P nano coating are cellular structure. Particles are cube rules, little less than 100 nm. The agglomerates of Cu-Sn-B nano coating like flower. Particles are oval sheet and their short diameter less than 150 nm. The agglomerates of Cu-W-P nano coating are triangular flake, the side length less than 100 nm.4. Coating structure does not change with formulation process. Cu-Ni-P,Cu-Sn-P,Cu-Sn-B,Cu-W-P nano coatings appear Cu(111) and Cu(200) at 2??43.29°, 2??50.43°respectively.5. After heat treatment, agglomerates of nano coatings become dispersed and their size decreased. Their edge merged and the crystallization of coatings from amorphous structure takes place.
Keywords/Search Tags:electroless plating, nano coatings, Cu-based ternary alloys, morphology, structure
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