| In recent years, the electronics manufacturing indus try is transforming from traditional lead solder to lead- free solder.Among many lead- free solders, the ternary eutectic Sn-Ag-Cu lead- free solder is internationally recognized as the best alternative for tin- lead eutectic alloy due to its appropriate melting temperature, nearly eutectic composition, good wetting properties and mechanical properties. Sn-3.0Ag-0.5Cu is currently the world's most widely used lead- free solder. Because Sn-3.0Ag-0.5Cu has a high Ag content and thus a higher cost, low silver lead- free solder gradually into the spotlight.The study choosed low silver lead- free solder Sn-1.0Ag-0.5Cu as the main object, in order to adapting the existing lead-free manufacturing process, selected lead- free solder alloy Sn-3.0Ag-0.5Cu as a reference object. This project carried out materials analysis test and reliability test to evaluate the wettability and mechanical properties of Sn-1.0Ag-0.5Cu, and the impact of high-temperature aging test and temperature cycling test on the reliability of its BGA solder.Studies have shown that the overall per formance difference between low silver lead-free solder Sn-1.0Ag-0.5Cu and currently the most widely used lead- free solder Sn-3.0Ag-0.5Cu is not large. Matched with appropriate process, low silver lead- free solder can also form reliable solder joints to meet the reliability standards in industrial production. Now the update cycle of ordinary consumer electronics products continues to accelerate, using low silver lead- free solder instead of high silver solder lead- free solder appropriately in some application conditions can significantly reduce costs and ensure the reliability of the product. With the deepening of the study on low silver lead- freesolder, it will have broad application prospects and promote the electronics manufacturing industry hugely. |
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